Model/Brand/Package
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Category: phototransistorDescription: SIDELED® This series of NPN silicon phototransistors that encapsulate OSRAM optoelectronic semiconductors all use SIDELED ® Surface mount (SMD) packaging. The high linearity P-LCC-2 package size is 4.2 x 4.2 x 3.8 mm and is only suitable for reflow soldering of infrared phototransistors, OSRAM Opto Semiconductors43565+$2.482725+$2.298850+$2.1700100+$2.1149500+$2.07812500+$2.03215000+$2.013710000+$1.9861 -
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Category: phototransistorDescription: TOPLED® Package # # # phototransistor, OSRAM Opto Semiconductors60225+$2.443525+$2.262550+$2.1358100+$2.0815500+$2.04532500+$2.00015000+$1.982010000+$1.9548 -
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Category: phototransistorDescription: TOPLED® The series of NPN phototransistors packaged with OSRAM Opto Semiconductors adopts TOPLED technology ® Encapsulation. TOPLED ® Phototransistors come in surface mount (SMD) PLCC-2 packages with transparent or daylight diffusing lenses. TOPLED ® Characteristics of phototransistor: High linearity PLCC-2 package surface mount (SMD) half angle: 60 ° Suitable for all soldering methods # # # Infrared phototransistor, OSRAM Opto Semiconductors40765+$2.961925+$2.742550+$2.5889100+$2.5231500+$2.47922500+$2.42445000+$2.402410000+$2.3695 -
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Category: phototransistorDescription: Phototransistor SIDELED ® Package size 3.8 x 3.4 x 4.2 mm PLCC-2 is only suitable for IR reflow soldering process # # # phototransistor, OSRAM Opto Semiconductors69305+$2.099325+$1.943850+$1.8349100+$1.7883500+$1.75722500+$1.71835000+$1.702710000+$1.6794
